Copper Foil Tape
Provides excellent solderability and conformity. Used for RFI/EMI shielding applications. Conductive adhesive is uniformly dispersed with conductive spheres to provide a very low rate of electrical resistance through the tape (.003 Ohms/sq.in.). Use as a cable wrap or seaming of EMI/RFI shielded forms for electrical continuity.
Typical applications for the non-conductive adhesive version are EMI/RFI shielding of small electromagnetic components (i.e. transformer/reactor coils) and cable splices; repairing, modifying & prototype designing of wiring boards, supplementary shielding of joints/seams; flat conductor assemblies. For the conductive adhesive version, applications include cable wrapping to provide EMI/RFI shielding, seaming of EMI/RFI shielded rooms for electrical continuity, static discharge draining, surface contact to non-solderable materials (e.g. aluminum or plastics). Meets MIL-T-47012.